Invention Grant
- Patent Title: Bonded laminate including a formed nonwoven substrate
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Application No.: US16690164Application Date: 2019-11-21
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Publication No.: US11020938B2Publication Date: 2021-06-01
- Inventor: Daniel Charles Peck , John Brian Strube , Matthew William Waldron , Jill Marlene Orr , Eric Bryan Bond
- Applicant: The Procter & Gamble Company
- Applicant Address: US OH Cincinnati
- Assignee: The Procter & Gamble Company
- Current Assignee: The Procter & Gamble Company
- Current Assignee Address: US OH Cincinnati
- Agent Sarah M DeCristofaro
- Main IPC: B32B7/10
- IPC: B32B7/10 ; B32B5/08 ; B32B23/10
Abstract:
Bonded formed laminates, and methods for making bonded formed laminates, are made from multiple layers of formed substrates comprising at least one nonwoven formed substrate which are bonded together at the distal ends or bases of protrusions formed in the substrates. The bonded formed laminate provides a very soft and lofty structure that is sustainable under compression.
Information query
