Invention Grant
- Patent Title: (Meth)acrylate compound, polymer, resist material, and method for producing (meth)acrylate compound
-
Application No.: US16719921Application Date: 2019-12-18
-
Publication No.: US11021433B2Publication Date: 2021-06-01
- Inventor: Daisuke Inoki , Teizi Satou , Hideki Hayashi
- Applicant: JNC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: JNC CORPORATION
- Current Assignee: JNC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JPJP2018-240956 20181225
- Main IPC: C07C69/653
- IPC: C07C69/653 ; C07C67/03 ; C08L33/14 ; G03F7/004 ; G03F7/038

Abstract:
A (meth)acrylate compound excellent in compatibility with other photosensitive resins and capable of providing a polymer with high transparency, a polymer, a resist material, and a method for producing the (meth)acrylate compound.
The (meth)acrylate compound is represented by formula (1).
The (meth)acrylate compound is represented by formula (1).
Public/Granted literature
- US20200223782A1 (METH)ACRYLATE COMPOUND, POLYMER, RESIST MATERIAL, AND METHOD FOR PRODUCING (METH)ACRYLATE COMPOUND Public/Granted day:2020-07-16
Information query