Invention Grant
- Patent Title: Conductive paste
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Application No.: US16771274Application Date: 2018-09-26
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Publication No.: US11021626B2Publication Date: 2021-06-01
- Inventor: Mariko Otani , Shun Hayakawa , Akihiro Horimoto , Mayo Miyachi
- Applicant: SUMITOMO BAKELITE CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO BAKELITE CO., LTD.
- Current Assignee: SUMITOMO BAKELITE CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Amin, Turocy & Watson, LLP
- Priority: JPJP2017-243901 20171220
- International Application: PCT/JP2018/035653 WO 20180926
- International Announcement: WO2019/123752 WO 20190627
- Main IPC: H01B1/22
- IPC: H01B1/22 ; C08K3/00 ; C09D11/52 ; C08F22/22 ; C08G77/20 ; C08K3/08 ; C08K3/36 ; C09D11/033 ; C09D11/037 ; C09D11/102 ; C09D11/107
Abstract:
A conductive paste of the present invention includes an elastomer composition containing silica particles (C), a conductive filler, and a solvent.
Public/Granted literature
- US20200377749A1 CONDUCTIVE PASTE Public/Granted day:2020-12-03
Information query
