Invention Grant
- Patent Title: Methods of forming a strengthened component
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Application No.: US15581627Application Date: 2017-04-28
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Publication No.: US11021802B2Publication Date: 2021-06-01
- Inventor: Dattu G V Jonnalagadda , Sebastian Merin , Balaraju Suresh , Daniel Dyer , Gordon Tajiri , Yanzhe Yang
- Applicant: Unison Industries, LLC
- Applicant Address: US FL Jacksonville
- Assignee: Unison Industries, LLC
- Current Assignee: Unison Industries, LLC
- Current Assignee Address: US FL Jacksonville
- Agency: McGarry Bair PC
- Main IPC: C25D1/02
- IPC: C25D1/02 ; F02C9/18 ; F01D9/06

Abstract:
A method of forming a strengthened component includes forming a sacrificial material into a mold of the component having an outer surface, disposing an insert having an inner surface and an outer surface opposite and spaced from the inner surface such that the strengthening insert inner surface abuts the mold outer surface, forming the component by way of electrodisposition of a metallic layer over the exposed mold outer surface and the exposed strengthening insert outer surface, and removing the sacrificial material from the component.
Public/Granted literature
- US20180312987A1 METHODS OF FORMING A STRENGTHENED COMPONENT Public/Granted day:2018-11-01
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