The invention comprises methods for fabricating and using a plurality of sensors on a substrate surface, such as ultrasonic sensor probes. The methods for fabricating sensors directly on the substrate surface includes the use of a template to dispose sensor material in an array and form a first layer on the substrate surface and a second template to dispose sensor electrode material in a corresponding array to form a second layer on top of the first layer. The invention provides a sensor housing that electrically connects the sensors and a computing device. The sensor housing may comprise a flexible circuit having a plurality of sensor electrode contact points corresponding to each of the sensors, at least one spring plate, a force distribution plate, and a plurality of cable wires attached to the flexible circuit and corresponding to each of sensor electrode contact points.