- Patent Title: Method of forming a top plane connection in an electro-optic device
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Application No.: US16674552Application Date: 2019-11-05
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Publication No.: US11022854B2Publication Date: 2021-06-01
- Inventor: Matthew Joseph Kayal , Steven Joseph Battista , Richard J. Paolini, Jr. , Shyamala A. Subramanian
- Applicant: E Ink Corporation
- Applicant Address: US MA Billerica
- Assignee: E Ink Corporation
- Current Assignee: E Ink Corporation
- Current Assignee Address: US MA Billerica
- Agent Brian D. Bean
- Main IPC: B29D11/00
- IPC: B29D11/00 ; G02F1/167 ; C09D11/52 ; H05K1/02 ; G02F1/1675 ; H05K3/40 ; G02F1/1343 ; G02F1/153 ; G02F1/155 ; B32B37/12 ; B32B38/00 ; B32B38/04 ; G02F1/1333 ; H05K3/32 ; H05K1/09

Abstract:
An electrical connection between the backplane and the light-transmissive front electrode of an electro-optic display is provided by forming an aperture through the top front electrode coupled and a substrate coupled thereto and subsequently introducing a flowable, electrically-conductive material into the aperture. The flowable, electrically-conductive material provides an electrical contact between the light-transmissive electrically-conductive layer and the backplane.
Public/Granted literature
- US20200064705A1 Method of Forming a Top Plane Connection in an Electro-Optic Device Public/Granted day:2020-02-27
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