Invention Grant
- Patent Title: Critical dimension uniformity
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Application No.: US16657551Application Date: 2019-10-18
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Publication No.: US11022878B2Publication Date: 2021-06-01
- Inventor: Xi-Zong Chen , Cha-Hsin Chao , Yi-Wei Chiu , Li-Te Hsu , Chih-Hsuan Lin
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H01L21/033
- IPC: H01L21/033 ; G03F7/004 ; G03F7/20 ; H01L21/02 ; H01L21/311 ; H01L21/027

Abstract:
The present disclosure describes a method for improving post-photolithography critical dimension (CD) uniformity for features printed on a photoresist. A layer can be formed on one or more printed features and subsequently etched to improve overall CD uniformity across the features. For example the method includes a material layer disposed over a substrate and a photoresist over the material layer. The photoresist is patterned to form a first feature with a first critical dimension (CD) and a second feature with a second CD that is larger than the first CD. Further, a layer is formed with one or more deposition/etch cycles in the second feature to form a modified second CD that is nominally equal to the first CD.
Public/Granted literature
- US20200050103A1 CRITICAL DIMENSION UNIFORMITY Public/Granted day:2020-02-13
Information query
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