Invention Grant
- Patent Title: Substrate production line and substrate production machine
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Application No.: US16469772Application Date: 2016-12-16
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Publication No.: US11022960B2Publication Date: 2021-06-01
- Inventor: Yoshiharu Tanizawa
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2016/087682 WO 20161216
- International Announcement: WO2018/109948 WO 20180621
- Main IPC: G05B19/418
- IPC: G05B19/418 ; H05K13/08 ; H05K13/04

Abstract:
A substrate production line including multiple substrate production machines arranged in a line; a shared folder in which an electronic file from each of the substrate production machines can be created and recognized; a substrate type grasping section on the substrate production machine furthest upstream in the line to grasp the type of the substrate; a file creating section on the substrate production machine other than the substrate production machine furthest downstream in the line to create in the shared folder a substrate type information file including substrate type information indicating the type of the substrate in accordance with unloading of the substrate; and a file recognizing section on the substrate production machine other than the substrate production machine furthest upstream in the line to recognize the substrate type information file created by the substrate production machine directly adjacent at the upstream side before the substrate is loaded.
Public/Granted literature
- US20200096975A1 SUBSTRATE PRODUCTION LINE AND SUBSTRATE PRODUCTION MACHINE Public/Granted day:2020-03-26
Information query
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