Invention Grant
- Patent Title: Processor package with optimization based on package connection type
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Application No.: US16024151Application Date: 2018-06-29
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Publication No.: US11023247B2Publication Date: 2021-06-01
- Inventor: Daniel Willis , Jonathan Thibado , Eugene Nelson
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Hanley, Flight & Zimmerman, LLC
- Main IPC: G06F9/38
- IPC: G06F9/38 ; G06F9/30 ; H01L23/31

Abstract:
The systems and methods disclosed herein provide an improved processor package to determine a connection type between the package and an external circuit and to optimize processor performance based on the connection type. As a non-limiting example, a processor package consistent with the present disclosure may include a central processing unit (CPU) die and a plurality of pins (including two connection detection pins) to connect the package to a motherboard. The CPU die may include connection determination logic and execution policy logic, implemented via processor code (“p-code”), as well as a more typical processor.
Public/Granted literature
- US20190042270A1 PROCESSOR PACKAGE WITH OPTIMIZATION BASED ON PACKAGE CONNECTION TYPE Public/Granted day:2019-02-07
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