Invention Grant
- Patent Title: Chip to chip interface with scalable bandwidth
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Application No.: US16700356Application Date: 2019-12-02
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Publication No.: US11023403B2Publication Date: 2021-06-01
- Inventor: Jafar Savoj , Jose A. Tierno , Sanjeev K. Maheshwari , Brian S. Leibowitz , Pradeep R. Trivedi , Gin Yee , Emerson S. Fang
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kowert Hood Munyon Rankin and Goetzel PC
- Agent Rory D. Rankin
- Main IPC: G06F13/42
- IPC: G06F13/42 ; G06F9/52 ; G06F13/40

Abstract:
A system and method for efficiently transporting data across lanes. A computing system includes an interconnect with lanes for transporting data between a source and a destination. When a source receives an indication of a bandwidth requirement change from a first data rate to a second data rate, the transmitter in the source sends messages to the receiver in the destination. The messages indicate that the data rate is going to change and reconfiguration of one or more lanes will be performed. The transmitter selects one or more lanes for transporting data at the second data rate. The transmitter maintains data transport at the first data rate while reconfiguring the selected one or more lanes to the second data rate. After completing the reconfiguration, the transmitter transports data at the second data rate on the selected one or more lanes while preventing data transport on any unselected lanes.
Public/Granted literature
- US20200183874A1 CHIP TO CHIP INTERFACE WITH SCALABLE BANDWIDTH Public/Granted day:2020-06-11
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