Invention Grant
- Patent Title: Under-memory array process edge mats with sense amplifiers
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Application No.: US16858475Application Date: 2020-04-24
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Publication No.: US11024366B1Publication Date: 2021-06-01
- Inventor: Yuan He
- Applicant: MICRON TECHNOLOGY, INC.
- Applicant Address: US ID Boise
- Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee Address: US ID Boise
- Agency: Dorsey & Whitney LLP
- Main IPC: G11C11/24
- IPC: G11C11/24 ; G11C11/4091 ; H01L23/528 ; H01L27/108

Abstract:
An edge memory array mat with access lines that are split, and a bank of sense amplifiers formed under the edge memory array may in a region that separates the access line segment halves. The sense amplifiers of the bank of sense amplifiers are coupled to opposing ends of a first subset of the half access lines pairs. The edge memory array mat further includes access line connectors configured to connect a second subset of the half access line pairs across the region occupied by the bank of sense amplifiers to form combined or extended access lines that extend to a bank of sense amplifiers coupled between the edge memory array mat and an inner memory array mat.
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