Invention Grant
- Patent Title: System and method for residual voltage control of electrostatic chucking assemblies
-
Application No.: US15945461Application Date: 2018-04-04
-
Publication No.: US11024529B2Publication Date: 2021-06-01
- Inventor: John M. White , Shreesha Y. Rao
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan LLP
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67 ; H01L51/56
Abstract:
Described herein is a substrate carrier comprising electrostatic chuck panels and using the same. The electrostatic chuck panels may include electrodes with interleaved segments. Further, the electrodes of each electrostatic chuck panel may be driven with chucking voltages having opposite polarities.
Public/Granted literature
- US20190311933A1 SYSTEM AND METHOD FOR RESIDUAL VOLTAGE CONTROL OF ELECTROSTATIC CHUCKING ASSEMBLIES Public/Granted day:2019-10-10
Information query
IPC分类:
