Invention Grant
- Patent Title: Manufacturing method of device chip
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Application No.: US16704334Application Date: 2019-12-05
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Publication No.: US11024542B2Publication Date: 2021-06-01
- Inventor: Heidi Lan
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain Ltd.
- Priority: JPJP2018-229006 20181206
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L23/00 ; H01L21/268 ; H01L21/3065 ; H01L21/304
Abstract:
A manufacturing method of a device chip includes a die bonding resin providing step of supplying a die bonding resin in a liquid state to a back surface side of a wafer with device chips formed on a front surface thereof and solidifying the die bonding resin, a water-soluble resin providing step of covering the die bonding resin with a water-soluble resin, a laser processing step of applying a laser beam from the back surface side of the wafer to remove the die bonding resin and the water-soluble resin, an etching step of etching an exposed portion on the back surface side of the wafer to divide the wafer, and a water-soluble resin removing step of supplying water on the back surface side of the wafer to remove the water-soluble resin.
Public/Granted literature
- US20200185275A1 MANUFACTURING METHOD OF DEVICE CHIP Public/Granted day:2020-06-11
Information query
IPC分类:
