Invention Grant
- Patent Title: Wafer processing method including applying a polyester sheet to a wafer
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Application No.: US16832266Application Date: 2020-03-27
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Publication No.: US11024543B2Publication Date: 2021-06-01
- Inventor: Shigenori Harada , Minoru Matsuzawa , Hayato Kiuchi , Yoshiaki Yodo , Taro Arakawa , Masamitsu Agari , Emiko Kawamura , Yusuke Fujii , Toshiki Miyai , Makiko Ohmae
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer, Burns & Crain, Ltd.
- Priority: JPJP2019-074964 20190410
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/268 ; H01L21/683
Abstract:
A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of blowing out air to push up each device chip and picking up each device chip from the polyester sheet.
Public/Granted literature
- US20200328118A1 WAFER PROCESSING METHOD Public/Granted day:2020-10-15
Information query
IPC分类:
