Invention Grant
- Patent Title: Integration of a programmable device and a processing system in an integrated circuit package
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Application No.: US16773501Application Date: 2020-01-27
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Publication No.: US11024583B2Publication Date: 2021-06-01
- Inventor: Austin H. Lesea , Sundararajarao Mohan , Stephen M. Trimberger
- Applicant: XILINX, INC.
- Applicant Address: US CA San Jose
- Assignee: XILINX, INC.
- Current Assignee: XILINX, INC.
- Current Assignee Address: US CA San Jose
- Agency: Patterson + Sheridan, LLP
- Main IPC: G06F15/78
- IPC: G06F15/78 ; H01L23/538 ; H01L23/50

Abstract:
An example integrated circuit (IC) package includes: a processing system and a programmable IC disposed on a substrate, the processing system coupled to the programmable IC through interconnect of the substrate; the processing system including components coupled to a ring interconnect, the components including a processor and an interface controller. The programmable IC includes: an interface endpoint coupled to the interface controller through the interconnect; and at least one peripheral coupled to the interface endpoint and configured for communication with the ring interconnect of the processing system through the interconnect endpoint and the interface controller.
Public/Granted literature
- US20200161247A1 INTEGRATION OF A PROGRAMMABLE DEVICE AND A PROCESSING SYSTEM IN AN INTEGRATED CIRCUIT PACKAGE Public/Granted day:2020-05-21
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