Invention Grant
- Patent Title: Substrate and package structure
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Application No.: US16199507Application Date: 2018-11-26
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Publication No.: US11024594B2Publication Date: 2021-06-01
- Inventor: Wei-Hung Lin , Hsiu-Jen Lin , Ming-Da Cheng , Yu-Min Liang , Chen-Shien Chen , Chung-Shi Liu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/488
- IPC: H01L23/488 ; H01L23/00
Abstract:
According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.
Public/Granted literature
- US20190096839A1 Substrate and Package Structure Public/Granted day:2019-03-28
Information query
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