Invention Grant
- Patent Title: Power module for supporting high current densities
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Application No.: US16171521Application Date: 2018-10-26
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Publication No.: US11024731B2Publication Date: 2021-06-01
- Inventor: Jason Patrick Henning , Qingchun Zhang , Sei-Hyung Ryu , Anant Kumar Agarwal , John Williams Palmour , Scott Allen
- Applicant: Cree, Inc.
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agency: Withrow & Terranova, P.L.L.C.
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/739 ; H01L29/06 ; H01L21/04 ; H01L25/18 ; H01L29/16 ; H01L27/06 ; H01L29/66 ; H01L29/04 ; H02M7/00 ; H02P7/03
Abstract:
A power module is disclosed that includes a housing with an interior chamber wherein multiple switch modules are mounted within the interior chamber. The switch modules comprise multiple transistors and diodes that are interconnected to facilitate switching power to a load. In one embodiment, at least one of the switch modules supports a current density of at least 10 amperes per cm2.
Public/Granted literature
- US20190067468A1 POWER MODULE FOR SUPPORTING HIGH CURRENT DENSITIES Public/Granted day:2019-02-28
Information query
IPC分类:
