Invention Grant
- Patent Title: Substrate processing system, substrate conveying device and conveying method
-
Application No.: US15872915Application Date: 2018-01-16
-
Publication No.: US11024762B2Publication Date: 2021-06-01
- Inventor: Lawrence Chung-Lai Lei
- Applicant: Lawrence Chung-Lai Lei
- Applicant Address: US CA Milpitas
- Assignee: Lawrence Chung-Lai Lei
- Current Assignee: Lawrence Chung-Lai Lei
- Current Assignee Address: US CA Milpitas
- Agency: Vista IP Law Group, LLP
- Priority: CN201710193126.9 20170328
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L31/18 ; B65G47/22 ; H01L21/67

Abstract:
A conveying device for conveying at least a first row of substrates and a second row of substrates, includes: a conveying fork having a main body and a plurality of branches, a first end of each of the branches is connected to the main body, and a second end of each of the branches is a free end; wherein a first branch of the plurality branches has a first plurality of grooves, and a second branch of the plurality of branches has a second plurality of grooves; and wherein one of the first plurality of grooves and one of the second plurality of grooves are configured to support one of the substrates in the first row.
Public/Granted literature
- US20180287007A1 SUBSTRATE PROCESSING SYSTEM, SUBSTRATE CONVEYING DEVICE AND CONVEYING METHOD Public/Granted day:2018-10-04
Information query
IPC分类: