Invention Grant
- Patent Title: Rotary electric machine having heat sink for semiconductor device of controller
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Application No.: US16461886Application Date: 2016-11-22
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Publication No.: US11025140B2Publication Date: 2021-06-01
- Inventor: Takanobu Kajihara , Katsuhiko Omae , Shunsuke Fushie , Tokiyoshi Tanigawa , Hiroyuki Miyanishi , Atsuki Fujita , Tomohiro Inoue , Yuki Okabe , Junya Suzuki
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Agent Richard C. Turner
- International Application: PCT/JP2016/084652 WO 20161122
- International Announcement: WO2018/096596 WO 20180531
- Main IPC: H02K9/22
- IPC: H02K9/22 ; H02K11/33 ; H02K7/116 ; B62D5/04 ; H02K11/00 ; H02K9/02 ; H02K9/00 ; H02K9/04 ; H02K9/24

Abstract:
In a rotary electric machine in which a controller and a heat sink are arranged in an extending direction of an output shaft of a motor, in order to provide a rotary electric machine which secures a heat rejection performance and an insulation performance of a semiconductor device to be mounted to the controller and is downsized as a whole, the controller includes a semiconductor device having a drive circuit provided so as to correspond to a stator winding of the motor, and the semiconductor device has a main face held in close contact with the heat sink. On a close contact face between the semiconductor device and the heat sink, a drive circuit is formed so as to extend along an outer edge portion of the heat sink to increase a cooling area.
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