Invention Grant
- Patent Title: Acoustic wave device, high-frequency front end circuit, and communication device
-
Application No.: US16511013Application Date: 2019-07-15
-
Publication No.: US11025221B2Publication Date: 2021-06-01
- Inventor: Masakazu Mimura , Kazuhiro Takigawa
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Priority: JPJP2017-006106 20170117
- Main IPC: H03H9/145
- IPC: H03H9/145 ; H01L41/047 ; H01L41/187 ; H03H9/02 ; H03H9/25 ; H03H9/64 ; H03H9/72 ; H03F3/20 ; H04B11/00

Abstract:
An acoustic wave device includes a piezoelectric substrate and an IDT electrode provided on the piezoelectric substrate. In the IDT electrode, a central region, first and second low acoustic velocity regions and first and second high acoustic velocity regions are disposed in this order. A duty ratio in the first low acoustic velocity region of first electrode fingers and the second low acoustic velocity region of second electrode fingers is larger than a duty ratio in the central region. When acoustic velocity of a transversal bulk wave propagating in metal that is a main component of a main electrode layer is defined as v (m/s), v≤3299 m/s, and when a wave length defined by an electrode finger pitch of the IDT electrode is defined as λ, and a film thickness of the main electrode layer normalized by the wave length λ is defined as T, then T≥0.00018e0.002V+0.014.
Public/Granted literature
- US20190341905A1 ACOUSTIC WAVE DEVICE, HIGH-FREQUENCY FRONT END CIRCUIT, AND COMMUNICATION DEVICE Public/Granted day:2019-11-07
Information query
IPC分类: