Invention Grant
- Patent Title: Quick acknowledgement reply method and apparatus
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Application No.: US16395063Application Date: 2019-04-25
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Publication No.: US11025397B2Publication Date: 2021-06-01
- Inventor: Yun Liu , Zezhou Luo , Yuchen Guo
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: CN Guangdong
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Guangdong
- Agency: Womble Bond Dickinson (US) LLP
- Priority: CN201610962981.7 20161026
- Main IPC: H04L5/00
- IPC: H04L5/00 ; H04W72/04 ; H04L1/18 ; H04L1/16

Abstract:
This application discloses a quick acknowledgement reply method and apparatus, where the method includes the following steps: receiving, by an acknowledgement sending apparatus, a data frame sent by an acknowledgement receiving apparatus; and after successfully decoding the data frame, generating and replying with, by the acknowledgement sending apparatus, an acknowledgement ACK frame, where the ACK frame includes a physical layer part; and the physical layer part includes: a legacy short training field L-STF, a legacy long training field L-LTF, and identification information of a station. This application is advantageous in low overheads.
Public/Granted literature
- US20190253226A1 QUICK ACKNOWLEDGEMENT REPLY METHOD AND APPARATUS Public/Granted day:2019-08-15
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