A method for producing a housing for electronics in which the housing is formed by a first housing element and a second housing element and in which the housing elements are composed of aluminum or an aluminum alloy. The method further includes connecting the housing elements to one another by welding so that the housing elements are held tightly together. The method also includes producing at least one of the housing elements by a die casting method in which gas that is created in the die-casting method is evacuated from the housing element by helium gas.