The present disclosure describes embodiments of apparatuses and methods related to a computing apparatus with a closed cooling loop thermally coupled to one or more processors disposed on a circuit board of the computing apparatus. The closed cooling loop circulates a dielectric fluid to absorb heat from the processor. A portion of the dielectric fluid is evaporated from the processor heat absorbed by the dielectric fluid. A heat exchanger is coupled to the circuit board and thermally coupled to the closed cooling loop. The heat exchanger is to include a coolant flow to remove heat from the dielectric fluid circulated through the portion of the closed cooling loop thermally coupled to the heat exchanger. A vapor portion of the dielectric fluid is condensed from the heat removed by the coolant flow. Other embodiments may be described and/or claimed.