Invention Grant
- Patent Title: Grinding material and production method of grinding material
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Application No.: US15737755Application Date: 2016-05-24
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Publication No.: US11027398B2Publication Date: 2021-06-08
- Inventor: Kazuo Saito , Kenji Shimoyama , Tomoki Iwanaga , Toshikazu Taura
- Applicant: BANDO CHEMICAL INDUSTRIES, LTD.
- Applicant Address: JP Hyogo
- Assignee: BANDO CHEMICAL INDUSTRIES, LTD.
- Current Assignee: BANDO CHEMICAL INDUSTRIES, LTD.
- Current Assignee Address: JP Hyogo
- Agency: JCIPRNET
- Priority: JPJP2015-123882 20150619
- International Application: PCT/JP2016/065327 WO 20160524
- International Announcement: WO2016/203914 WO 20161222
- Main IPC: B24D3/02
- IPC: B24D3/02 ; B24D11/00 ; B24D3/00 ; C09K3/14 ; B24D3/34 ; B24D3/04 ; B24D13/14 ; B24D11/02 ; B24D3/14 ; B24D18/00 ; C09C1/68

Abstract:
The purpose of the present invention is to provide a grinding material which has a superior grinding rate and planarizing accuracy, with the grinding rate being less likely to be reduced over a relatively long period of time. The present invention is directed to a grinding material including a base, a grinding layer overlaid on a front face side of the base and including grinding grains and a binder for the grinding grains, and an adhesion layer overlaid on a back face side of the base, in which the grinding grains are diamond grinding grains, a wear quantity of the grinding layer as determined by a Taber abrasion test is no less than 0.03 g and no greater than 0.18 g, and, an Asker D hardness measured from a front face side of the grinding layer is no less than 80° and no greater than 98°.
Public/Granted literature
- US20180185985A1 GRINDING MATERIAL AND PRODUCTION METHOD OF GRINDING MATERIAL Public/Granted day:2018-07-05
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