Invention Grant
- Patent Title: Heat-resistant weld backing tape for high energy applications
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Application No.: US16246709Application Date: 2019-01-14
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Publication No.: US11028292B2Publication Date: 2021-06-08
- Inventor: Michael Hacikyan , Graeme S. Barritte
- Applicant: Michael Hacikyan
- Applicant Address: US NY North Tonawanda
- Assignee: Michael Hacikyan
- Current Assignee: Michael Hacikyan
- Current Assignee Address: US NY North Tonawanda
- Agent Walter W. Duft
- Main IPC: B23K9/00
- IPC: B23K9/00 ; C09J9/00 ; C09J7/38 ; C09J7/28 ; C09J5/10 ; B32B7/12 ; B32B7/06 ; B32B15/14 ; B32B15/20 ; B32B5/02 ; B23K9/035

Abstract:
A heat-resistant weld backing tape for placement between a backing member and a workpiece to be welded at a root gap. The weld backing tape includes a flexible tape substrate. The tape substrate has a longitudinal length that extends between first and second tape substrate ends, and a lateral width that extends between first and second tape substrate side edges. The tape substrate has a substantially planar first face and a substantially planar second face. The first and second tape substrate faces are mutually parallel and spaced from each other by a tape substrate thickness. The tape substrate length and the tape substrate width are substantially larger than the tape substrate thickness. A heat-resistant material is disposed on the first tape substrate face and arranged to face the workpiece during welding. An adhesive material is disposed on the second tape substrate face and arranged to face the backing member during welding.
Public/Granted literature
- US20200224065A1 Heat-Resistant Weld Backing Tape For High Energy Applications Public/Granted day:2020-07-16
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