Invention Grant
- Patent Title: Dual cure adhesive composition and methods for its preparation and use
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Application No.: US16621756Application Date: 2018-08-21
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Publication No.: US11028297B2Publication Date: 2021-06-08
- Inventor: Gang Lu , Nick Shephard , Ryan Thomas , Matthew Olsen
- Applicant: Dow Silicones Corporation
- Applicant Address: US MI Midland
- Assignee: Dow Silicones Corporation
- Current Assignee: Dow Silicones Corporation
- Current Assignee Address: US MI Midland
- Agent Catherine U. Brown
- International Application: PCT/US2018/047125 WO 20180821
- International Announcement: WO2019/040383 WO 20190228
- Main IPC: C08G77/18
- IPC: C08G77/18 ; C09J183/14 ; C08G77/08 ; C08G77/16 ; C08G77/48 ; C08K5/14 ; C08K5/23 ; C08K5/57
Abstract:
A dual cure (condensation and free radical reaction) adhesive composition is useful for electronics applications.
Public/Granted literature
- US20210002532A9 DUAL CURE ADHESIVE COMPOSITION AND METHODS FOR ITS PREPARATION AND USE Public/Granted day:2021-01-07
Information query
