- Patent Title: Cleaning agent composition for substrate for semiconductor device
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Application No.: US16474918Application Date: 2017-12-22
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Publication No.: US11028343B2Publication Date: 2021-06-08
- Inventor: Daisuke Kayakubo , Jun Naganuma
- Applicant: KAO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: KAO CORPORATION
- Current Assignee: KAO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JPJP2016-256228 20161228
- International Application: PCT/JP2017/046192 WO 20171222
- International Announcement: WO2018/123889 WO 20180705
- Main IPC: C11D7/34
- IPC: C11D7/34 ; C11D3/04 ; H01L21/02 ; C11D3/20 ; C11D11/00 ; C11D3/34 ; H01L21/304
Abstract:
In one aspect, provided is a cleaning agent composition for a substrate for a semiconductor device, the cleaning agent composition having excellent cleaning properties against ceria and being capable of reducing a temporal change in the solubility of ceria.
In one aspect, the present disclosure relates to a cleaning agent composition for a substrate for a semiconductor device, the cleaning agent composition containing a component A, a component B, a component C, and a component D, the component A being sulfuric acid; the component B being ascorbic acid; the component C being at least one of thiourea and dithiothreitol and the component D being water.
In one aspect, the present disclosure relates to a cleaning agent composition for a substrate for a semiconductor device, the cleaning agent composition containing a component A, a component B, a component C, and a component D, the component A being sulfuric acid; the component B being ascorbic acid; the component C being at least one of thiourea and dithiothreitol and the component D being water.
Public/Granted literature
- US20210130739A1 CLEANING AGENT COMPOSITION FOR SUBSTRATE FOR SEMICONDUCTOR DEVICE Public/Granted day:2021-05-06
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