Invention Grant
- Patent Title: Soft magnetic alloy optimized for metal injection molding
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Application No.: US16273761Application Date: 2019-02-12
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Publication No.: US11028468B2Publication Date: 2021-06-08
- Inventor: John C. DiFonzo , Abhijeet Misra , Charles J. Kuehmann , Daniel T. McDonald
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Dorsey & Whitney LLP
- Main IPC: C22C38/10
- IPC: C22C38/10 ; H01F41/02 ; H01F1/147 ; C22C33/02 ; H01F1/22 ; H01F1/20 ; H04R1/10
Abstract:
A component for an electronic device can include a metal alloy formed by a metal injection molding process. The metal alloy can have a composition of about 32 wt % to about 38 wt % cobalt and about 62 wt % to about 68 wt % iron.
Public/Granted literature
- US3202522A Cementitious product Public/Granted day:1965-08-24
Information query
