Invention Grant
- Patent Title: Apparatus for measuring wafer
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Application No.: US16846978Application Date: 2020-04-13
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Publication No.: US11029256B2Publication Date: 2021-06-08
- Inventor: Tae-Heung Ahn , Racine Nassau , Su Hwan Park , Ki Wan Seo , Nam Il Koo , In Keun Baek , Jong Min Yoon , Ik Seon Jeon
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2019-0088357 20190722
- Main IPC: G01N21/95
- IPC: G01N21/95

Abstract:
Provided is an apparatus for measuring a wafer. The apparatus may include a chuck disposed on a stage and a plate connected with the stage, a horizontal frame configured to support a wafer, and a vertical frame connecting the plate and the horizontal frame. The apparatus may further include first to third adsorption portions connected with the horizontal frame and configured to adsorb the wafer, a support bar penetrating through the chuck and extending in a first direction and a beam irradiator connected to the support bar and disposed between the plate and the horizontal frame. The beam irradiator may be configured to irradiate a beam on the wafer. The apparatus may further include a detector on an opposite side of the horizontal frame from the beam irradiator and configured to receive the beam after it has penetrated through the wafer.
Public/Granted literature
- US20210025832A1 APPARATUS FOR MEASURING WAFER Public/Granted day:2021-01-28
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