Invention Grant
- Patent Title: Resist composition and method of forming resist pattern
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Application No.: US16535647Application Date: 2019-08-08
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Publication No.: US11029600B2Publication Date: 2021-06-08
- Inventor: Takehito Seo , Tomoyuki Hirano , Yuta Iwasawa , Yusuke Itagaki
- Applicant: TOKYO OHKA KOGYO CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee Address: JP Kawasaki
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JPJP2018-168205 20180907
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/004 ; G03F7/038 ; C08F220/28 ; G03F7/20 ; C08F220/16 ; C08F220/36 ; G03F7/16 ; G03F7/38 ; G03F7/32

Abstract:
A resist composition including a resin component having more than 30 mol % of a structural unit represented by formula (a0-1), and an acid generator represented by formula (b1) in which R01 represents a hydrogen atom, an alkyl group or a halogenated alkyl group; Va01 represents an alkylene group; Ra01 represents an acid dissociable group; Rb01 represents an cyclic hydrocarbon group; Lb01 represents —O—C(═O)— or —C(═O)—O—; Yb01 represents a divalent linking group or a single bond; Vb01 represents a fluorinated alkylene group; Rb02 represents a fluorine atom or a hydrogen atom; provided that the total number of fluorine atoms contained in Vb01 and Rb02 is 2 or 3; and Mm+ represents an m-valent organic cation.
Public/Granted literature
- US20200081345A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN Public/Granted day:2020-03-12
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