Invention Grant
- Patent Title: Modular chassis with fabric integrated into the line card
-
Application No.: US15476678Application Date: 2017-03-31
-
Publication No.: US11029749B2Publication Date: 2021-06-08
- Inventor: Frank Szu-Jen Yang , Jason Luo Pang , Mark Tehmin Yin
- Applicant: Platina Systems Corp.
- Applicant Address: US CA Santa Clara
- Assignee: Platina Systems Corp.
- Current Assignee: Platina Systems Corp.
- Current Assignee Address: US CA Santa Clara
- Agency: Baker Botts L.L.P.
- Main IPC: G06F1/3287
- IPC: G06F1/3287 ; G06F1/18 ; G06F1/20 ; G06F1/30 ; G06F1/3296 ; G06F13/36 ; G06F13/40 ; H04L12/46 ; H04L12/723 ; H04L29/06
Abstract:
In one embodiment, a system includes a number of application-specific integrated circuits (ASICs). At least one of the ASICs is configured to process incoming data packets and outgoing data packets. At least one of the ASICs is configured to move data between a respective networking module and a destination networking module. The system also includes a cable backplane having a number of parallel cables configured to transmit data between the number of ASICs.
Public/Granted literature
- US20170286339A1 Modular Chassis with Fabric Integrated into the Line Card Public/Granted day:2017-10-05
Information query
IPC分类:
