Invention Grant
- Patent Title: Modular event-based performance monitoring in integrated circuit development
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Application No.: US16587356Application Date: 2019-09-30
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Publication No.: US11030370B2Publication Date: 2021-06-08
- Inventor: Lahiruka Winter , Daniel Saconn , Kyle Phillips , Connor Nace , Zachary Neumann
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent William Kinnaman
- Main IPC: G06F30/3323
- IPC: G06F30/3323 ; G06F119/18 ; G06F119/12

Abstract:
Systems and methods to implement performance monitoring of a device under test involve defining one or more sequences. Each of the one or more sequences includes two or more events, each of the two or more events being defined by one or more hardware signals that include a hardware register value, transmission of a message or signal, or a wire voltage change. A method includes initiating a simulation of the device under test by inputting one or more signals at one or more inputs of the device under test for propagation across the device under test, and monitoring completion of the two or more events defining each of the one or more sequences. Performance of the device under test is reported. Reporting includes providing latency of each of the one or more sequences. A final design of the device under test is provided for fabrication based on the performance monitoring.
Public/Granted literature
- US20210097146A1 MODULAR EVENT-BASED PERFORMANCE MONITORING IN INTEGRATED CIRCUIT DEVELOPMENT Public/Granted day:2021-04-01
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