A wire harness assembly including a first connector, a second connector, and conductors extending between the first connector and the second connector. Contacts are provided on the second connector. The contacts have termination sections which are mounted on the second connector, compliant sections which extend from the termination sections, and substrate engagement sections which extend from the compliant sections. The substrate engagement sections have curved contact sections which are configured to be positioned in mechanical and electrical engagement with circuit pads of a mating printed circuit board. Embossments are provided on the curved contact sections to provide additional strength and stability to the curved contact sections.