- Patent Title: Camera module including reinforcement members for supporting printed circuit board on which plurality of image sensors are disposed and electronic device including the same
-
Application No.: US16053128Application Date: 2018-08-02
-
Publication No.: US11032459B2Publication Date: 2021-06-08
- Inventor: Hwajoong Jung , Manho Kim , Taehyuk Kim , Taeyun Kim , Yonghwan Choi , Kihuk Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: KR10-2017-0106293 20170822
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H05K1/02

Abstract:
An apparatus and method for a camera module is provided. The camera module includes a substrate, a first image sensor disposed in a first area on one side of the substrate, a second image sensor disposed in a second area on the one side, a reinforcement member disposed in an area around the first area and the second area so as to support at least a portion of the substrate, a first housing disposed in an area including at least a portion of the first area so as to be stacked on the first image sensor and one part of the reinforcement member while accommodating a first lens part corresponding to the first image sensor, and a second housing disposed in an area including at least a portion of the second area so as to be stacked on the second image sensor and the other part of the reinforcement member.
Public/Granted literature
Information query