Invention Grant
- Patent Title: Earpieces
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Application No.: US16648821Application Date: 2017-11-16
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Publication No.: US11032634B2Publication Date: 2021-06-08
- Inventor: Hui He , Hang Yan Yuen
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- International Application: PCT/US2017/061930 WO 20171116
- International Announcement: WO2019/099007 WO 20190523
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R1/10

Abstract:
The present disclosure is drawn to an earpiece. The earpiece can include a speaker suitable for use within or adjacent to an ear canal of a user and a layered composite associated with the speaker. The layered composite can include an expanded polytetrafluoroethylene (PTFE) layer, a self-supporting substrate applied to a first side of the expanded PTFE layer, and a fabric substrate applied to a second side of the expanded PTFE layer. The expanded polytetrafluoroethylene layer can have a pore size having an average value from 0.1 micron to 0.5 micron. The self-supporting substrate can define a contour of the earpiece.
Public/Granted literature
- US20200280793A1 EARPIECES Public/Granted day:2020-09-03
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