Invention Grant
- Patent Title: Wired circuit board and production method thereof
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Application No.: US16464422Application Date: 2017-11-06
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Publication No.: US11032913B2Publication Date: 2021-06-08
- Inventor: Shusaku Shibata , Takahiro Takano , Hayato Takakura , Yoshihiro Kawamura , Shuichi Wakaki
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils LLC
- Agent Jean C. Edwards, Esq.
- Priority: JPJP2016-232481 20161130
- International Application: PCT/JP2017/039980 WO 20171106
- International Announcement: WO2018/100974 WO 20180607
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/10 ; H05K1/18 ; H05K3/18

Abstract:
An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0
Public/Granted literature
- US20200344888A1 WIRED CIRCUIT BOARD AND PRODUCTION METHOD THEREOF Public/Granted day:2020-10-29
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