Invention Grant
- Patent Title: Heat shield assembly for an epitaxy chamber
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Application No.: US16566055Application Date: 2019-09-10
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Publication No.: US11032945B2Publication Date: 2021-06-08
- Inventor: Shinichi Oki , Yoshinobu Mori
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H05K7/20 ; C23C16/48

Abstract:
Disclosed herein is a heat shield assembly for a processing chamber. The processing chamber includes a body having sidewalls, a bottom and a lid that define an interior volume. The heat shield assembly is disposed in the interior volume, and includes a heat shield and a preheat member. The preheat member includes an inner circumference, and is positioned below the heat shield. A susceptor is disposed in the interior volume and configured to support a substrate, and is positioned within the inner circumference of the preheat member. An opening is positioned between the susceptor and the preheat member. A first section of the opening is proximate to a gas inlet, and is covered by the heat shield. A second section of the annular opening is proximate a gas outlet, and is not covered by the heat shield member.
Public/Granted literature
- US20210015004A1 HEAT SHIELD ASSEMBLY FOR AN EPITAXY CHAMBER Public/Granted day:2021-01-14
Information query
IPC分类: