Invention Grant
- Patent Title: Lamination molding apparatus
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Application No.: US15415870Application Date: 2017-01-26
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Publication No.: US11033967B2Publication Date: 2021-06-15
- Inventor: Shuichi Kawada , Satoshi Nomiyama
- Applicant: Sodick Co., Ltd.
- Applicant Address: JP Kanagawa
- Assignee: Sodick Co., Ltd.
- Current Assignee: Sodick Co., Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: JCIPRNET
- Priority: JPJP2016-082747 20160418
- Main IPC: B22F12/00
- IPC: B22F12/00 ; B33Y30/00 ; B33Y40/00 ; B22F3/24 ; B22F10/10

Abstract:
A lamination molding apparatus is provided capable of preventing damage to a cutting device. Every time a sintered body including a sintered layer group consisting of a predetermined number of sintered layers is formed, gas is injected from a gas injector toward a vicinity of a side surface of the newly formed sintered body so as to blow off material powder, and then the side surface of the sintered body is shaved by a cutting tool of the cutting device, wherein the gas injector blows off the material powder by only intermittent injection which repeats short-time gas injection or by a combination of the intermittent injection and continuous injection which continuously injects the gas.
Public/Granted literature
- US20170297105A1 LAMINATION MOLDING APPARATUS Public/Granted day:2017-10-19
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