Invention Grant
- Patent Title: Thermal conductive member and heat dissipation structure including the same
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Application No.: US16498648Application Date: 2018-03-28
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Publication No.: US11034623B2Publication Date: 2021-06-15
- Inventor: Saori Inoue , Toshitaka Yamagata , Yoshitaka Minakata , Ryo Yoshimatsu , Ryuji Koga
- Applicant: DENKA COMPANY LIMITED
- Applicant Address: JP Tokyo
- Assignee: DENKA COMPANY LIMITED
- Current Assignee: DENKA COMPANY LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2017-065991 20170329
- International Application: PCT/JP2018/013026 WO 20180328
- International Announcement: WO2018/181606 WO 20181004
- Main IPC: C04B35/583
- IPC: C04B35/583 ; H01L23/34 ; C04B41/83 ; H01L23/373 ; C04B111/00

Abstract:
A thermal conductive member includes: first and second surface layers including an insulating material A, and an intermediate layer including an insulating material B. The insulating material A includes a first boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.6 to 1.4, and a first heat curable resin composition impregnating in the first boron nitride sintered body. The insulating material B includes a second boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.01 to 0.05, and a second heat curable resin composition impregnating in the second boron nitride sintered body.
Public/Granted literature
- US20200031723A1 THERMAL CONDUCTIVE MEMBER AND HEAT DISSIPATION STRUCTURE INCLUDING THE SAME Public/Granted day:2020-01-30
Information query
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