Invention Grant
- Patent Title: Polyamide resin composition with high fluidity
-
Application No.: US15779938Application Date: 2016-11-29
-
Publication No.: US11034835B2Publication Date: 2021-06-15
- Inventor: Hidetake Nakano , Tetsuya Nakamura , Hirokazu Tanaka
- Applicant: MITSUI CHEMICALS, INC.
- Applicant Address: JP Tokyo
- Assignee: MITSUI CHEMICALS, INC.
- Current Assignee: MITSUI CHEMICALS, INC.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JPJP2015-234534 20151201
- International Application: PCT/JP2016/085400 WO 20161129
- International Announcement: WO2017/094720 WO 20170608
- Main IPC: C08L77/00
- IPC: C08L77/00 ; C08L23/26 ; C08L77/06 ; C08K3/00 ; C08K3/013

Abstract:
Disclosed is a polyamide resin composition including 50% to 99% by mass of a polyamide (P) and 1% to 50% by mass of an acid-modified polyolefin (Q) satisfying the following requirements (1) to (3). (1) A melt flow rate (MFR) as measured at 230° C. under a load of 2.16 kg is 50 to 200 (g/10 min). (2) An acid modification amount is 0.1% to 2.0% by mass. (3) The acid-modified polyolefin (Q) includes a modified product (q1) of an elastomer including 10% to 95% by mole of an ethylene-derived skeleton unit, 0% to 80% by mole of a propylene-derived skeleton unit, and 3% to 40% by mole of a skeleton unit derived from an α-olefin having 4 to 8 carbon atoms (with a total amount of the ethylene-derived skeleton unit, the propylene-derived skeleton unit, and the skeleton unit derived from an α-olefin being 100% by mole), the elastomer being modified by maleic acid or an anhydride thereof.
Public/Granted literature
- US20180362761A1 POLYAMIDE RESIN COMPOSITION WITH HIGH FLUIDITY Public/Granted day:2018-12-20
Information query