Invention Grant
- Patent Title: Polishing agent, stock solution for polishing agent, and polishing method
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Application No.: US16493409Application Date: 2018-03-02
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Publication No.: US11034860B2Publication Date: 2021-06-15
- Inventor: Masayuki Hanano , Kouji Mishima , Naomi Watanabe
- Applicant: HITACHI CHEMICAL COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery, L.L.P.
- Priority: JPJP2017-048555 20170314
- International Application: PCT/JP2018/008133 WO 20180302
- International Announcement: WO2018/168534 WO 20180920
- Main IPC: C09G1/02
- IPC: C09G1/02 ; C09K3/14 ; H01L21/3105
Abstract:
A polishing agent containing abrasive grains and water, in which the abrasive grains contain silica particles, an average particle diameter Rave of the abrasive grains is 50 nm or more, a ratio Rave/Rmin of the average particle diameter Rave to an average minor diameter Rmin of the abrasive grains is 1.0 to 2.0, and a zeta potential of the abrasive grains in the polishing agent is positive.
Public/Granted literature
- US20200017718A1 POLISHING AGENT, STOCK SOLUTION FOR POLISHING AGENT, AND POLISHING METHOD Public/Granted day:2020-01-16
Information query
