Invention Grant
- Patent Title: Connection structure of optical waveguide chips
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Application No.: US16619911Application Date: 2018-06-07
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Publication No.: US11036015B2Publication Date: 2021-06-15
- Inventor: Kota Shikama , Hiroshi Ishikawa , Yuko Kawajiri , Atsushi Aratake
- Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
- Applicant Address: JP Tokyo
- Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
- Current Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Womble Bond Dickinson (US) LLP
- Priority: JPJP2017-112436 20170607,JPJP2017-117442 20170615,JPJP2017-119304 20170619,JPJP2017-228660 20171129
- International Application: PCT/JP2018/021854 WO 20180607
- International Announcement: WO2018/225820 WO 20181213
- Main IPC: G02B6/36
- IPC: G02B6/36 ; G02B6/42 ; G02B6/24 ; G02B6/125 ; G02B6/26 ; G02B6/12

Abstract:
A connection structure of optical waveguide chips includes a base substrate (2003) in which grooves (2013) are formed, spacer optical fibers (2006) each disposed for a corresponding one of the grooves (2013) and fitted in the groove (2013) while partially projecting from the base substrate (2003), and silica-based PLCs (2001, 2002) that are a plurality of optical waveguide chips in each of which grooves (2007) fitted on the projecting portions of the spacer optical fibers (2006) are formed at positions of an optical waveguide layer (2008) facing the grooves (2013), and each of which is mounted on the base substrate (2003) while being supported by the spacer optical fibers (2006). The silica-based PLCs (2001, 2002) are mounted on the base substrate (2003) such that incident/exit end faces of the optical waveguide layers (2008) face each other.
Public/Granted literature
- US20200209477A1 CONNECTION STRUCTURE OF OPTICAL WAVEGUIDE CHIPS Public/Granted day:2020-07-02
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