Invention Grant
- Patent Title: Array substrate and method of manufacturing the same, display panel and display apparatus
-
Application No.: US16832155Application Date: 2020-03-27
-
Publication No.: US11036108B2Publication Date: 2021-06-15
- Inventor: Yuntian Zhang , Peng Jiang , Ke Dai , Jingang Liu , Lihui Han , Zhonghou Wu , Chunxu Zhang , Mengmeng Li
- Applicant: HEFEI BOE DISPLAY TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Anhui; CN Beijing
- Assignee: HEFEI BOE DISPLAY TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: HEFEI BOE DISPLAY TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Anhui; CN Beijing
- Agency: McDermott Will and Emery LLP
- Priority: CN201910798360.3 20190827
- Main IPC: G02F1/1362
- IPC: G02F1/1362 ; G09G3/34 ; G02F1/1333 ; G02F1/13357 ; G02F1/1368 ; G02F1/1335

Abstract:
An array substrate includes a substrate, at least one first light-shielding layer disposed above the substrate, semiconductor retention layers disposed on a side of the at least one first light-shielding layer facing away from the substrate, and data lines disposed on a side of the plurality of semiconductor retention layers facing away from the at least one first light-shielding layer. One first light-shielding layer of the at least one first light-shielding layer is disposed between one semiconductor retention layer of the semiconductor retention layers and the substrate, and an orthographic projection of the first light-shielding layer on the substrate covers an orthographic projection of the semiconductor retention layer on the substrate. The data lines are in one-to-one correspondence with the semiconductor retention layers, and an orthographic projection of each data line on the substrate overlaps with an orthographic projection of a corresponding semiconductor retention layer on the substrate.
Public/Granted literature
- US20210063831A1 ARRAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, DISPLAY PANEL AND DISPLAY APPARATUS Public/Granted day:2021-03-04
Information query
IPC分类: