Invention Grant
- Patent Title: Heat dissipation module and projection apparatus
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Application No.: US16561044Application Date: 2019-09-05
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Publication No.: US11036118B2Publication Date: 2021-06-15
- Inventor: Wen-Yen Chung , Yi-Han Lai
- Applicant: Coretronic Corporation
- Applicant Address: TW Hsin-Chu
- Assignee: Coretronic Corporation
- Current Assignee: Coretronic Corporation
- Current Assignee Address: TW Hsin-Chu
- Agency: JCIPRNET
- Priority: CN201821460990.7 20180907
- Main IPC: G03B21/16
- IPC: G03B21/16 ; G03B21/14 ; G03B21/20 ; H04N9/31 ; F28D1/02 ; F28D15/02 ; H05K7/20 ; H01B7/42 ; F28D21/00

Abstract:
A heat dissipation module and a projection apparatus are provided. The heat dissipation module dissipates the heat generated by a plurality of heating elements, includes a heat pipe, a heat dissipation plate, a first and a second heat dissipation fins. The heat pipe includes a first portion of the heat pipe passes through the first heat dissipation fin and a second portion of the heat pipe passes through the second heat dissipation fin and a third portion connected with the first and the second portions. The third portion of the heat pipe and the heating elements are connected to the heat dissipation plate. The heat generated by the heating elements is dissipated by the heat dissipation plate, the first and the second heat dissipation fins through thermal conduction method and thermal convection method. The invention saves accommodating space in the projection apparatus and has an efficient heat dissipation effect.
Public/Granted literature
- US20200081331A1 HEAT DISSIPATION MODULE AND PROJECTION APPARATUS Public/Granted day:2020-03-12
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