Invention Grant
- Patent Title: Substrate processing method and substrate processing device
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Application No.: US16079149Application Date: 2017-02-14
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Publication No.: US11036142B2Publication Date: 2021-06-15
- Inventor: Kota Sotoku
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Ostrolenk Faber LLP
- Priority: JPJP2016-061911 20160325
- International Application: PCT/JP2017/005338 WO 20170214
- International Announcement: WO2017/163672 WO 20170928
- Main IPC: G03F7/42
- IPC: G03F7/42 ; H01L21/304 ; H01L21/311 ; H01L21/67 ; H01L21/027

Abstract:
The substrate processing method is a substrate processing method for removing a resist having a hardened layer from a substrate on a surface of which the resist is formed, including: a substrate holding step of holding the substrate; and a resist stripping step of stripping the resist from the surface of the substrate by supplying ozone gas and superheated steam to a plural-fluid nozzle for producing liquid drops through mixing a plurality of fluids to discharge mixed gas of ozone gas and superheated steam containing liquid drops of ozone water produced by mixing ozone gas and superheated steam from the plural-fluid nozzle toward the surface of the substrate.
Public/Granted literature
- US20190043708A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE Public/Granted day:2019-02-07
Information query
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