Invention Grant
- Patent Title: Thermally aware memory management
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Application No.: US16417746Application Date: 2019-05-21
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Publication No.: US11036406B2Publication Date: 2021-06-15
- Inventor: Girisankar Paulraj , Daniel Lewis , Sumantra Sarkar , Arindam Raychaudhuri , Diyanesh B. Chinnakkonda Vidyapoornachary
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent David K. Mattheis; William H. Hartwell; Nicholas L. Cadmus
- Main IPC: G11C7/04
- IPC: G11C7/04 ; G06F3/06 ; G11C29/12 ; G06F9/445
Abstract:
Managing system memory allocation according to a thermal profile defining memory segment policies according to power, performance, and thermal requirements, selecting a defined memory segment policy, implementing a system workload according to the memory segment policy and deploying the system workload according to the implemented memory segment policy.
Public/Granted literature
- US20200371699A1 THERMALLY AWARE MEMORY MANAGEMENT Public/Granted day:2020-11-26
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