Invention Grant
- Patent Title: Method and apparatus for simulating flexible panel
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Application No.: US15986075Application Date: 2018-05-22
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Publication No.: US11036901B2Publication Date: 2021-06-15
- Inventor: Xixi Guo , Shang Chieh Chu , Shiming Shi
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Westman, Champlin & Koehler, P.A.
- Priority: CN201711190986.3 20171124
- Main IPC: G06F30/20
- IPC: G06F30/20 ; G01N3/02 ; H05K3/00

Abstract:
The embodiments of the present disclosure provide a method and apparatus for simulating a flexible panel. The method comprises: establishing a geometric model of the flexible panel; cutting a layer adjacent to a layer where a wiring region is located in the geometric model of the flexible panel; partitioning the following regions or layers in the cut geometric model into grid cells: the wiring region, layers other than the layer where the wiring region located and the layer adjacent to the layer where the wiring region is located, and regions obtained by cutting the layer adjacent to the layer where the wiring region is located; and simulating the flexible panel based on the partition.
Public/Granted literature
- US20190163845A1 METHOD AND APPARATUS FOR SIMULATING FLEXIBLE PANEL Public/Granted day:2019-05-30
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