Invention Grant
- Patent Title: Inspecting apparatus based on hyperspectral imaging
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Application No.: US16444719Application Date: 2019-06-18
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Publication No.: US11037283B2Publication Date: 2021-06-15
- Inventor: Sung-Ho Jang , Yasuhiro Hidaka , Young-kyu Park , Ye-eun Park , Yu-Sin Yang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2018-0159423 20181211
- Main IPC: G06T7/00
- IPC: G06T7/00 ; G02B27/09 ; G02B5/30 ; H04N13/239 ; G02B26/12

Abstract:
Provided is a hyperspectral imaging (HSI)-based inspection apparatus capable of quickly and stably performing two-dimensional (2D) HSI for an inspection object, and accordingly, capable of quickly and accurately inspecting the inspection object. The HSI-based inspection apparatus includes: a stage on which an inspection object is arranged; an optical system configured to allow light to be incident on the inspection object and emit the light reflected from the inspection object; a scan mirror configured to reflect the emitted light from the optical system while rotating; and a hyperspectral camera configured to obtain an image having a wavelength direction and a line direction as two axes for light reflected from the scan mirror, wherein, by using the rotation of the scan mirror, the hyperspectral camera is configured to perform the 2D HSI for the inspection object.
Public/Granted literature
- US20200184624A1 INSPECTING APPARATUS BASED ON HYPERSPECTRAL IMAGING Public/Granted day:2020-06-11
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