Invention Grant
- Patent Title: Resin film with controlled youngs modulus
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Application No.: US16211887Application Date: 2018-12-06
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Publication No.: US11037592B2Publication Date: 2021-06-15
- Inventor: Makoto Handa , Amane Hirose , Tatsuya Ogawa , Mitsuo Tojo
- Applicant: TEIJIN FILM SOLUTIONS LIMITED
- Applicant Address: JP Tokyo
- Assignee: TEIJIN FILM SOLUTIONS LIMITED
- Current Assignee: TEIJIN FILM SOLUTIONS LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPJP2017-235214 20171207,JPJP2017-235215 20171207,JPJP2018-092227 20180511,JPJP2018-092230 20180511
- Main IPC: G11B5/73
- IPC: G11B5/73 ; G11B5/012 ; G11B15/43

Abstract:
To provide a resin film, of which dimensional stability required of an ultra-high density recording medium can be controlled easily by drive tension, and which has processability at high temperature in a processing step of the resin film into a magnetic recording medium. A resin film having a Young's modulus in the film longitudinal direction of 1 GPa or more and a film thickness of 1 μm or more, wherein the product of the Young's modulus in the longitudinal direction and the thickness is 5 GPa·μm or more and 20 GPa·μm or less and wherein a dimensional change in the film longitudinal direction is −2% or more and +2% or less when the film is heated at a rate of 5° C./min under a load of 2 kg/mm2 applied in the longitudinal direction and the temperature has reached 110° C., the resin film satisfying at least either of the following (1) or (2): (1) the Young's modulus in the film longitudinal direction is 6 GPa or less and the film thickness is 4.5 μm or less; and (2) the Young's modulus in the film longitudinal direction is 4 GPa or less and the film thickness is 6 μm or less.
Public/Granted literature
- US20190180781A1 RESIN FILM Public/Granted day:2019-06-13
Information query
IPC分类: