Invention Grant
- Patent Title: Coil component
-
Application No.: US15986255Application Date: 2018-05-22
-
Publication No.: US11037718B2Publication Date: 2021-06-15
- Inventor: Joung Gul Ryu
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2017-0167532 20171207
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F27/28 ; H01F27/24 ; H01F41/04 ; H01F41/12 ; H01F27/32 ; H01F17/04 ; H01F17/00

Abstract:
A coil component includes a body and external electrodes disposed on an external surface of the body. The body includes a support member including a through hole and a via hole, a coil including embedded coil patterns embedded in the support member and conductor layer disposed on the embedded coil patterns, and a magnetic material encapsulating the support member and the coil.
Public/Granted literature
- US20190180914A1 COIL COMPONENT Public/Granted day:2019-06-13
Information query